Four-Position Vacuum Coating System with Magnetron Sputtering MAGNA TM 5 for Metal Layer Application

Purpose: The unit is designed for deposition of metallisation layers by magnetron sputtering of target material. Maximum diameter of processed plates, mm150 Number of simultaneously processed items at ?150 mm, pcs.3 Maximum residual pressure in the working chamber (with closed airlock), Pa9*10-5 Film thickness irregularity, %±5 Number of working positions of magnetron carousel, pcs.4 Plate heating temperature, ?C300 Number of magnetrons, pcs.6 Magnetron target diameter, mm100 Power supply capacity, kW3 Number of magnetron power supply sources, pcs.2 Minimum ion energy from ion cleaning source, eV600 Maximum ion energy from ion cleaning source, eV800 Rotational speed of two-stage planetary substrate holder, rpm30 Number of gas lines with gas flow regulators, pcs.2 Air pumping speed of cryogenic pump, l/s6500 Pumping speed of cryogenic pump for argon, l/s5400 Pumping speed...