LED-580 Soldering Oven for Convection SMD Soldering

LED-580 Soldering Oven for Convection SMD Component Soldering

Manufacturer: TECHNO-ALLIANCE ELECTRONICS LLC
Price: Request Quote

Bulk pricing available

FOB, CIF & EXW terms available

Description

Soldering furnaces for SMD components.Chamber furnace convection reflow LED-580 is designed for group reflow soldering on the thermal profile of long LED lines on the basis of aluminium, textolite PCBs and conventional PCBs in small-scale and pilot production. As well as for soldering in the conditions of repair areas of serial production.

Specifications

Assignment
Chamber furnace LED-580 is designed for group soldering by thermal profile of long LED lines on the basis of aluminium, textolite printed circuit boards and conventional printed circuit boards in conditions of small-scale and pilot production. As well as
Width of heating surface
180 mm
Length of heating surface
580 mm
Height of the heating chamber
Built-in memory card slot, support microSD/SDHC/SDXC card (up to 256GB); manual recording/alarm recording mm
Rated power of heater
2800 W
Temperature stability
-2-2 °C
Operating temperature range
50...350 °C
Number of independent heating zones
2 pcs
Infrared radiation range, µm
2...10
Weight of furnace (with air cooling unit)
16.4 kg
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Delivery & Payment

Shipping Terms

FOB Novorossiysk, Russia CIF Available to major ports worldwide EXW Manufacturer's facility, Russia

Delivery Time

Sea freight: 30-60 days (depending on destination) Air freight: 14-21 days (for urgent orders)

Payment Methods

Letter of Credit (L/C) Wire Transfer (T/T) Escrow Services

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