Plasma Chemical Anisotropic Selective Etching System TM 200-01 for Efficient Substrate Processing

Group and individual processing of substrates on the substrate holder in one technological cycle: 60x48mm - 7 pieces; Ø 76mm - 4 pieces; Ø 100, 150, 200mm - 1 piece; Sluice chamber for loading and unloading of substrates; Transport system for transfer of wafers from the lock chamber to the working chamber on the basis of the transport system. The transport system for transfer of wafers from the airlock to the working chamber on the basis of a manipulator; Working gases: CL?, HBr, SF?, O2, CF?, He, N?; Helium cooling and mechanical plate clamping; Consumption power not exceeding 14 kW; Oil-free pumping system; Possibility to build in a clean room..