UVN-71P-3M-1 Vacuum Coating System for Thermal Deposition on Substrates

The vacuum spraying unit UVN-71P-3M-1 is designed for one-sided deposition of metallic and resistive films on polycor and sithallic substrates by thermal vacuum sputtering in the production of hybrid-film microcircuits. Maximum number of substrates with the size of 60x48x(0,5...1,0) mm 11 pcs. The unit has 4 resistive evaporators.

Time to reach the residual pressure of 4 x 10-4 Pa in the working chamber after opening of the high-vacuum shutter not more than 60 min. The unit provides: -regulation of rotation speed of the carousel with substrates in the range from 10 to 60 rpm; -heating of the carousel with substrates up to 300 °C; -control of the witness resistance of film sputtering on substrates in the range from 0 to 100 kOhm; -power of the ion source up to 200 W; -power of the first resistive evaporator up to 0.8 kW at current up to 50 A; -power of the second, third and fourth power of the second, third and fourth resistive evaporators each up to 2 kW at current up to 500 A.